Home Industry News Japan, U.S. to deepen cooperation in cutting-edge chips

Japan, U.S. to deepen cooperation in cutting-edge chips

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Japan and the U.S. will deepen cooperation in building supply chains for cutting-edge semiconductor devices, amid growing rivalry between Washington and Beijing.

The two governments are close to agreeing on cooperation in producing chips more advanced than 2 nanometers, Nikkei has learned. They are also working on a framework to prevent technology leaks, with China in mind.

Both countries are worried about their dependence on Taiwanese and other suppliers and seek to diversify sources. Taiwan Semiconductor Manufacturing Co. is the leading development of the 2-nanometer technology, while IBM also completed a prototype in 2021.

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